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Removing and Replacing Memory DIMMs
007-4701-003 107
Removing and Replacing Memory DIMMs
This section provides guidelines for DIMM selection and installation, followed by
instructions to install and remove DIMMs.
Memory DIMM Group Placement and Guidelines
Memory is contained on cards that are referred to as DIMMs (dual inline memory
modules). Each base compute, XG2N, CPU expansion, or CMPX module can contain
four, eight, or twelve DIMMs installed in DIMM slots located on the module’s node
board.
These twelve DIMM slots are organized into three groups of four DIMMs each, as shown
in Figure 4-23 on page 108.
DIMMs are installed one per DIMM slot, and must be installed in groups of four.
Follow these guidelines when installing DIMM groups:
• Memory is increased or decreased in four-DIMM group increments only.
• Each of the four DIMMs that make up a DIMM group must be the same memory
size and speed; however, different groups of DIMMs can differ in memory size.
• The first four DIMMs (group 0) must be in place for the base compute module to
operate properly.
• Mixing DIMM groups with different access speeds will cause the memory bus to
default to the speed used for the slowest group.
• The maximum bus speed for a completely full set of DIMM memory slots (three
installed groups), defaults to 100 MHz or 133 MHz, depending on the type of
DIMMs installed.
• The DIMMs used in the Silicon Graphics Prism platform modules are not
compatible with DIMMs used in the Origin 200, Origin 350 series, SGI 3000 series,
SGI 2000 series, Onyx systems, Fuel, Octane or Tezro systems.
- Silicon Graphics Prism 1
- Visualization System 1
- Configurations 1
- Record of Revision 3
- 007-4701-003 vii 7
- 007-4701-003 ix 9
- Contents 10
- About This Guide 17
- Important Information 18
- Chapter Descriptions 19
- Related Publications 20
- Conventions 21
- Product Support 21
- Reader Comments 22
- 007-4701-003 1 23
- XG2N and Compute Modules 24
- 007-4701-003 3 25
- Module Pipe Numbering) 25
- 4 007-4701-003 26
- Pipe Numbering) 26
- Front Panel Controls 27
- 6 007-4701-003 28
- 007-4701-003 7 29
- Internal Components 30
- Safety Precautions 31
- ESD Precautions 32
- Safety Measures 33
- Quick Start Information 34
- 007-4701-003 13 35
- Components within rack 36
- 16 007-4701-003 38
- Connecting a Monitor 40
- Keyboard 41
- USB type A 41
- Base compute module 41
- 20 007-4701-003 42
- 007-4701-003 21 43
- Power-On the System 44
- Verifying System Connections 45
- 24 007-4701-003 46
- Powering Off Manually 47
- 007-4701-003 27 49
- Physical Features 50
- 17U rack 51
- 39U rack 51
- Functional Architecture 52
- 007-4701-003 31 53
- 32 007-4701-003 54
- System Components 55
- 34 007-4701-003 56
- XG2N Graphics Module 57
- CPU Expansion Module 58
- Front view 59
- Rear view 59
- 007-4701-003 39 61
- Router Module 62
- (as shown in Figure 2-7): 64
- ELEC RATING 65
- 100-240VAC 65
- 1.0-0.6A 65
- FUSE 250V-6.3A 65
- Storage Expansion 66
- 46 007-4701-003 68
- 007-4701-003 47 69
- Power Components 70
- 007-4701-003 49 71
- 50 007-4701-003 72
- Figure 2-13 Shelf Rails 72
- Optional Devices 74
- Optional IO9 PCI Card 75
- Optional Tape Devices 75
- Optional DM8 Audio Board 76
- Cables and Connectors 77
- Functional Features 77
- Troubleshooting Tips 78
- Optional USB Extender 79
- 3. Configurations and Cabling 81
- System Configurations 82
- 007-4701-003 65 87
- Minimum Routed Configuration 88
- 007-4701-003 67 89
- Maximum Routed Configuration 90
- 007-4701-003 69 91
- 70 007-4701-003 92
- 3: Configurations and Cabling 92
- 007-4701-003 71 93
- Safety Instructions 94
- 007-4701-003 73 95
- Opening the Cover 96
- 007-4701-003 75 97
- 76 007-4701-003 98
- 007-4701-003 77 99
- 78 007-4701-003 100
- 007-4701-003 79 101
- Closing the Cover 102
- PCI and PCI-X Cards 103
- 82 007-4701-003 104
- 007-4701-003 83 105
- 84 007-4701-003 106
- 007-4701-003 85 107
- 86 007-4701-003 108
- Removing a PCI or PCI-X Card 109
- 88 007-4701-003 110
- 007-4701-003 89 111
- 90 007-4701-003 112
- 007-4701-003 91 113
- 92 007-4701-003 114
- 007-4701-003 93 115
- 94 007-4701-003 116
- 007-4701-003 95 117
- 96 007-4701-003 118
- 007-4701-003 97 119
- Disk Drives 120
- Installing a Disk Drive 121
- 100 007-4701-003 122
- Removing a Disk Drive 123
- 102 007-4701-003 124
- 007-4701-003 103 125
- 104 007-4701-003 126
- 007-4701-003 105 127
- 106 007-4701-003 128
- 007-4701-003 107 129
- 108 007-4701-003 130
- Installing a DIMM Group 131
- 110 007-4701-003 132
- 007-4701-003 111 133
- Figure 4-25 Inserting a DIMM 133
- Removing a DIMM 134
- 007-4701-003 113 135
- Figure 4-26 Removing a DIMM 135
- L1 Controller Display 136
- 007-4701-003 115 137
- 116 007-4701-003 138
- 007-4701-003 117 139
- 118 007-4701-003 140
- System” on page 22 141
- 5. Troubleshooting 143
- Troubleshooting Chart 144
- L1 Controller Error Messages 146
- SGI Electronic Support 152
- 007-4701-003 131 153
- 132 007-4701-003 154
- 5: Troubleshooting 154
- 007-4701-003 133 155
- Sample Stereo Mode Entries 157
- 5. Save the gdm.conf file: 159
- 6. Restart graphics: 159
- 6. Save the gdm.conf file: 161
- 7. Restart graphics: 161
- Enabling Overlay Planes 162
- 007-4701-003 141 163
- Configuring Monitor Positions 165
- SG-0 SG-1 166
- SG-2 SG-3 166
- Configuring Monitor Types 167
- 146 007-4701-003 168
- Identifying Event Devices 169
- 148 007-4701-003 170
- A. Technical Specifications 177
- Environmental Specifications 178
- Compute Module Specifications 179
- Characteristic Specification 180
- CMPX Module Specifications 181
- Router Module Specifications 182
- Rack Specifications 183
- 007-4701-003 163 185
- Compute Module 186
- 007-4701-003 165 187
- XG2N Module Connectors 188
- Pin Function Pin Function 189
- CMPX Module 190
- SGI TP900 Storage Module 191
- DB-9 Serial Connector 192
- RJ-45 Connector 194
- Pin Assignment Pin Assignment 195
- USB Type A Connector 197
- USB Type B Connector 198
- 007-4701-003 177 199
- 178 007-4701-003 200
- 007-4701-003 179 201
- Slide Rail Mounting Hardware 203
- 182 007-4701-003 204
- 007-4701-003 183 205
- 184 007-4701-003 206
- Preparing the Module 207
- 186 007-4701-003 208
- 007-4701-003 187 209
- 188 007-4701-003 210
- 007-4701-003 189 211
- 190 007-4701-003 212
- 007-4701-003 191 213
- 007-4701-003 193 215
- 194 007-4701-003 216
- 007-4701-003 195 217
- Figure B-11 218
- C. Installing Rack Systems 219
- Pre-Installation Activities 220
- Power Receptacle Verification 221
- 200 007-4701-003 222
- C: Installing Rack Systems 222
- 007-4701-003 201 223
- 202 007-4701-003 224
- 007-4701-003 203 225
- 204 007-4701-003 226
- Inspecting the Shipping Crate 227
- 206 007-4701-003 228
- 007-4701-003 207 229
- 208 007-4701-003 230
- 007-4701-003 209 231
- 210 007-4701-003 232
- 007-4701-003 211 233
- Figure C-7 Leveling Bolts 233
- O) position. Then 233
- 212 007-4701-003 234
- 007-4701-003 213 235
- Figure C-9 Leveling Bolts 235
- O) position 235
- 214 007-4701-003 236
- 007-4701-003 215 237
- Figure C-10 Joining Locations 237
- System Model Number 239
- Electromagnetic Emissions 240
- VCCI Notice (Japan Only) 241
- Shielded Cables 242
- Electrostatic Discharge 242
- Laser Compliance Statements 243
- Lithium Battery Statement 244
- 224 007-4701-003 246
- 226 007-4701-003 248
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